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FWF80002-S04S22GYB

The pictures are for reference only for installation methods, please refer to the specifications and drawings for details

Sales Drawings:
FWF80002 Series.pdf
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Product number: FWF80002-S04S22GYB
Category: Wire to Board Connectors
Specification: Pitch:8.00mm
Type: Socket
Mounting Style: Through Hole
Angle: 180°Vertical
Circuits: 4Circuits
Status: Active
Description: Wafer 10-8mm ,4Circuits ,180° Vertical(DIP) ,Gray
Stock(pcs): 0
Lead time: Estimated delivery date 2024-05-20
MPQ: 1000
MOQ: 50000
Type: Wafer 10-8mm 180° Vertical (DIP)
EU RoHS: Compliant(2011/65/EU)
EU REACH: Dose not contain REACH SVHC(1907/2006/EC)
EU ELV: Compliant(2000/53/EC)

Product Specification

Category
Category Wafer 180° Vertical (DIP)
Pitch 8.0mm
Height 16.5mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0
FFH25437-D22S1004K6K
Female Header 2.54mm ,Double row ,22Circuits ,180° Vertical(DIP) ,PA6T
FID25407-403K6K
IDC 2.54mm 40Circuits(3 Assemblies)
FTS050030-N087A-01
FFC Pitch: 0.5mm 30Pin L=87mm
FVD0901-S2SIB0
D-SUB CONNECTOR 9Circuits Cover(Share with 3 rows 15 Circuits)
FWF30004-S11S22K6B
Wafer 3mm 180°Vertical 11Circuits (DIP)
Quantity Unit Price
1 $0.085350
10 $0.079875
50 $0.068925
100 $0.063450
500 $0.052500
1000 $0.034723
2500 $0.034249
5000 $0.033775
10000 $0.033301
25000 $0.032827

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Sales Drawings

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