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FWF80002 Wafer 10-8mm 180° Vertical (DIP)

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Specification
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Product Specification

Category
Category Wafer 180° Vertical (DIP)
Pitch 8.0mm
Height 16.5mm
Electrical
Current - Maximum per Contact 5.00A
Voltage - Maximum 250V
Contact Resistance 10 mΩ Max
Insulation Resistance 1000 MΩ Min
Withstanding Voltage 1500V AC r.m.s
Temperature Range operating -25℃+85℃
Material and Plating
Material-Metal Brass
Material - Plating Mating Tin
Material - Plating Termination Tin
Material - Resin PA66 UL94V-0

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FWF80002 Wafer 10-8mm 180° Vertical (DIP)

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