The connector terminal is the key component to realize the transmission performance of the connector. Considering cost control and processing difficulty, most terminals on the market are made of phosphor bronze or brass. Due to the high electrical performance requirements of contacts, electroplating is essential. Commonly used connector terminal gold plating processes include: immersion plating, micro immersion plating, brush plating, spot plating, wheel plating, paste plating, etc.
Immersion plating refers to controlling the depth of the plated parts immersed in the plating solution by adjusting the height of the positioning bracket in the plating tank to obtain a predetermined gold plating area. It can be used in combination with other processes to meet the requirements of more complex gold plating specifications.
The gold plating range of micro immersion plating is more targeted, especially for the gold plating requirements of SMT parts of terminals with complex structures. Compared with ordinary immersion plating process, it can reduce the cost waste of unnecessary gold-plated areas; it can also meet the gold-plating effect that cannot be achieved by brush plating.
The brush plating process is suitable for local selective gold plating of bump or flat terminals. The partial surface of the plating piece is in contact with the brush plating platform up and down, and under the action of the DC power supply, the metal ions in the plating solution are used to reduce and deposit on the predetermined part of the cathode plating piece.
The spot plating process is usually suitable for products that are locally precisely plated with gold. During spot plating, it is necessary to open a special mold in advance according to the appearance and shape of the product to be plated and the requirements of the plating area to achieve continuous and accurate plating of the designated parts of the product. The spot plating process not only has good stability of electroplating quality and high precision, but also can reduce the waste of gold plating cost.
The wheel plating process is suitable for partial selective gold plating of flat terminals or full gold plating. The non-plated area is shielded by the combined belt, and under the action of the DC power supply, the metal ions in the bottom spray liquid are reduced and deposited on the unshielded area of the cathode plating piece.
The stick plating process is usually suitable for products that are accurately plated with partial continuity. Using paste plating equipment, paste a layer of special special material film on the area of the product surface that does not need electroplating, and then through the combination with other gold plating processes (such as wheel plating, etc.), the precise electroplating of the predetermined part (exposed) of the product is realized. The process has good stability and high debugging accuracy, which can significantly reduce the waste of gold plating costs in unscheduled areas and provide a perfect plating appearance.
Through the above process processing, the oxidation of the connector terminal can be significantly prevented, the solderability can be increased, the wear resistance can be increased, the electrical conductivity of the circuit can be directly improved, and the service life of the connector terminal can be prolonged.
TXGA is a leader among domestic connector manufacturers, and its production technology is professional and mature. It has provided reliable, professional and stable connector products for the industry for more than ten years. Purchase connectors and enter TXGA [Product Center].
