In the design of server computing power boards and industrial automation equipment, the compact PCB interlayer space provides massive signal channels for high-speed data transmission, and maintains stable connections for a long time under extreme working conditions. A single high-performance connector can no longer meet the composite selection requirements of high-end equipment. The TXGA HDesra series 1.27mm high-speed high-density board to board connector combines high-speed transmission capability, high-density wiring advantages, and harsh environmental reliability, providing a one-stop solution to meet the comprehensive selection needs of high-end equipment board interconnection.
Product Features
Standardized precision design
The entire HDesra series adopts a unified 1.27mm precision center spacing, and offers three stacking heights to choose from: 7/8.5/10mm. The 8.5mm stacking height also has two combination methods, which can flexibly adapt to the assembly space of different PCB interlayers, directly helping equipment iterate towards miniaturization and modular structures.
Its complete selection matrix covers all mainstream pin specifications, from 40 bits suitable for small bandwidth scenarios to 400 bit high-density interconnects supporting multiple I/O requirements. With 4 to 10 rows of multi pin layouts, it can freely match various PCB wiring designs without compromising overall board card planning for connector specifications.
Improve assembly efficiency
The entire series adopts standard SMT surface mount technology, which can perfectly adapt to fully automatic surface mount production lines. The welding consistency performance is excellent, which can greatly improve the assembly efficiency in the mass production stage and reduce batch differences caused by manual welding.
At the same time, the product adopts a 180 ° vertical docking structure combined with an exclusive foolproof design, which can efficiently complete docking in both manual and automated assembly scenarios, and is not prone to offset and misalignment. It effectively reduces the assembly failure rate from the structural level and reduces the rework cost at the production end.
high-speed transmission
The terminal contacts of the HDesra series use gold plating technology, with a contact resistance of only 50m Ω Max, which can significantly reduce signal loss during high-frequency transmission and ensure the integrity of high-speed data throughout the process. The entire series natively supports 56Gbps PAM4 high-speed transmission, perfectly adapting to current mainstream high-speed buses such as PCIe and CXL, fully meeting the ultra large bandwidth transmission needs of data centers and edge AI computing devices.
safety performance
A single contact can carry a current of 1A, with a rated voltage of 240V. It has a 700V AC withstand voltage and a gigabit level insulation resistance, effectively avoiding safety hazards such as high voltage breakdown and leakage, and building a strong electrical defense line for the operation of the entire machine.
Multi industry application scenarios
In server and AI computing board scenarios, the internal PCB interlayer space of the device is compact, and multi-channel high-speed data is prone to transmission loss. The HDesra series, with a high-density spacing of 1.27mm and a high-speed transmission capacity of 56Gbps, can achieve stable transmission of massive high-speed data in limited space; Faced with the environment of large temperature fluctuations and continuous equipment vibration in industrial sites, ordinary connectors are prone to signal disconnection problems. The HDesra series has a wide temperature range of -55 ℃ to 125 ℃ and a high elastic terminal structure, which can fully guarantee the long-term and high-precision stable operation of industrial equipment.
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