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Writer:板对板连接器 Posted time {{1790219253000|timezoneDate({format:'YYYY-MM-DD HH:mm:ss'})}} views:6
Under the trend of lightweight and precision consumer electronics, the connection space between PCB boards is constantly compressed, and conventional connectors often find it difficult to balance compact layout and stable electrical performance at the same time. The TXGA FBB04009 series board to board connectors are tailor-made for this type of extremely narrow space interconnection scenario, with precise structural design to achieve reliable electrical connections under high-density wiring.
Core structure design
The TXGA FBB04009 series adopts a circular groove dual contact structure, making the contact arrangement more compact and accommodating more connection points within a limited PCB area, greatly saving internal space of the equipment. At the same time, the dual contact force structure can effectively buffer external impact, avoiding common problems of virtual connection and loosening of single contacts. Even if the equipment is subjected to vibration or slight bumps, it can still maintain a stable connection state.
The terminals are treated with gold plating to ensure the oxidation resistance and conductivity of the contacts. Each contact can carry a current of 0.3A and withstand a voltage of 60V, maintaining stable electrical transmission performance even in small connection spaces.
Performance parameters
Maximum current: 0.3A
Maximum voltage: 60V
Contact resistance: 90 m Ω maximum value
Insulation resistance: 100 M Ω minimum value
Product Advantages
Circular groove dual contact structure, more compact contact arrangement, and more stable connection structure
The product combination height is only 0.8mm, suitable for the stacking space requirements of ultra-thin devices
Adopting SMT surface mount technology, adapted to automated mass production welding process
Supports a wide temperature range of -55 º C to+85 º C for operation, meeting the requirements of harsh working conditions
Industry Applications
Widely applicable to consumer electronics scenarios with strict space requirements, such as mobile phone LCD, OLED displays, mobile phone motherboards, camera modules, earpiece components, etc., providing compact, stable, and reliable electrical interconnection solutions between boards for precision electronic devices.