Environmental temperature and humidity can affect the service life of connectors

Environmental temperature and humidity are important factors affecting the reliability of electronic connectors. Through a series of chemical reactions, they can easily cause contact failure and insulation failure, ultimately reducing the service life of the connector and causing frequent equipment failures.

The reason why environmental temperature and humidity are prone to contact failure is that the contact material of the connector is generally copper metal, and copper will undergo oxidation reaction under the action of environmental temperature stress, forming an oxide film layer. As the oxide film layer grows and thickens, due to its poor conductivity, the thickened film layer increases the contact resistance of the contact body, ultimately leading to contact failure of the connector.

Insulation failure is caused by the fact that connector insulators are mainly made of materials such as polymer polymers. Under the action of temperature stress, the movement of molecules inside the polymer material will accelerate, and vacancies will be generated on its molecular chains. At this time, harmful gases and other media in the air will penetrate and diffuse into the material, and under the influence of environmental temperature, the material will undergo thermal degradation and cross-linking reactions, leading to material degradation and a decrease in physical and electrical properties, resulting in a decrease in the insulation performance of the insulator, ultimately leading to connector insulation failure.